Precision Ultrasonic Flow Monitoring in Semiconductor Manufacturing: Selecting Between Clamp-On, Inline, and Micro-Flow Architectures
In semiconductor wafer fabrication, chemical mechanical planarization (CMP), wet bench etching, and high-density liquid cooling, fluid flow monitoring is directly tied to yield rates and operational stability. However, process media range from hyper-aggressive acids and slurries to micro-doses of expensive chemical additives. Ultrasonic Flow Monitoring in Semiconductor Manufacturing: Selecting Between Clamp-On, Inline, and Micro-Flow Architectures To meet these specialized constraints without introducing mechanical wear or cross-contamination, R&B Instrument Inc. offers a versatile suite of ultrasonic transit-time flow sensors tailored to specific field conditions. 1. RBCS Clamp-On Series: Eliminating Contamination and Leakage Risks For ultra-pure chemical delivery and wafer cleaning lines constructed from high-purity plastics (such as PFA and PTFE), cutting pipes is unacceptable. Non-Invasive Architecture: The RBCS Series clamps directly onto the tube wall. Ultrasonic sound waves ...